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Open-Silicon Tapes Out Industry's First High Bandwidth Memory

Open-Silicon Tapes Out Industry's First High Bandwidth Memory

Beyond Silicon – What Will Replace the Wonder Material?

High Bandwidth Memory - Wikipedia

Semiconductor Sales To Rise at 7.1% CAGR Through 2026

AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology - Feb 7, 2023

Samsung, SK Hynix enhance memory packaging investments, eyeing explosive HBM demand to start in 2024

Silicon ICs node evolution and 2D semiconductor scaling potential. a)

Apple unveils M3, M3 Pro, and M3 Max, the most advanced chips for a personal computer - Apple (UK)

OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset

What Makes High Bandwidth Memory Different?

Three New Memory Trends in Enterprise Data Centers - SoC and IP - Cadence Blogs - Cadence Community

Revolution of High Bandwidth Memory (HBM) in the Age of AI

Accelerating High-Bandwidth Memory to light speed – Blocks and Files

AI Tools Take Chip Design Industry by Storm: 200+ Chips Tape Out